Tin Solder Ball BGA Reballing Soldering Heat Universal Stencil Balls Reball Ball BGA Ball for GPU CPU IC Chip PCB(9 bottles 0.3mm-0.76mm)

Product ID : 37995728

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Galleon Product ID 37995728

UPC / ISBN 792117157882

Shipping Weight 0.44 lbs
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Model Walfrontcsmh3xzwqf-01

Manufacturer Walfront

Shipping Dimension 6.26 x 3.62 x 0.83 inches
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Before ₱ 2,756

₱ 2,368

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Get it between 2025-01-02 to 2025-01-09. Additional 3 business days for provincial shipping.

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• Electrical items MAY be 110 volts.
• 7 Day Return Policy
• All products are genuine and original
• Cash On Delivery/Cash Upon Pickup Available

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Tin Solder Ball BGA Reballing Soldering Heat Features

• This tin solder ball 100% brand new and high quality, material for a long time use.

• These tin balls are used for connection of semiconductor chip, circuit module and PCB board.

• They are quite small and can transmit electronic , very useful for your soldering work.

• Each bottle contains about 25000 solder balls that will meet your basic soldering need.

• There are many different sizes you can choose, and you can choose 9 bottles to get them all.

About Tin Solder Ball BGA Reballing Soldering Heat

Specification: Type(Optional) Quantity Size Weight #1 9 bottles 0.3mm-0.76mm 200g/7.1oz #2 1 bottle 0.3mm 9g/0.3oz #3 1 bottle 0.35mm 10g/0.4oz #4 1 bottle 0.4mm 13g/0.5oz #5 1 bottle 0.45mm 16g/0.6oz #6 1 bottle 0.5mm 18g/0.6oz #7 1 bottle 0.55mm 25g/0.9oz #8 1 bottle 0.6mm 28g/1oz #9 1 bottle 0.65mm 36g/1.3oz #10 1 bottle 0.76mm 40g/1.4oz Package list: 1 set * Solder Balls