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Area Array Packaging Handbook: Manufacturing and Assembly
Product ID : 43003294
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Galleon Product ID
43003294
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8,236
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About Area Array Packaging Handbook: Manufacturing And
*Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC) *Details the pros and cons of each technology with varying applications *Examines packaging ramifications of high density interconnects (HDI)
