BGA Activated Rosin Solder Paste Tin Rosin-Based Flux Paste Cream for Soldering Rework Station Circuit Board PCB BGA SMD Soldering Repair (80g)

Product ID : 33659616

Product Rating

4.6 out of 5 stars

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Galleon Product ID 33659616

UPC / ISBN 699973050817

Shipping Weight 0.1 lbs
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Model 80G Rosin Flux Paste

Manufacturer DIYPHONE

Shipping Dimension 4.21 x 3.58 x 0.98 inches
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Before ₱ 1,055

₱ 927

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Get it between 2025-01-01 to 2025-01-08. Additional 3 business days for provincial shipping.

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• Electrical items MAY be 110 volts.
• 7 Day Return Policy
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BGA Activated Rosin Solder Paste Tin Rosin-Based Features

• MECHANIC Advanced Paste Flux Soldering for mobile phone motherboard Repair, electric Soldering Iron Welding Fluxes for phone circuit board repair.

• Its boiling point only slightly higher than the melting point of the solder, For mobile phones, PC cards and other sophisticated electronic chip-level help welding.

• High bond strength, PH value neutral, insulation is strong, welding surface smooth, is no corrosive for IC and PCB.

• Wipe the surface of the object before soldering, apply the paste flux to the solder joint, solder the tin to the solder joint with soldering iron.

• Specifications: Model: MECHANIC-UV80; Color: Yellow, Weight: 0.08kg; Viscosity: 0.2Pas; Granularity: 0.22um; Packing: Aluminum box.

About BGA Activated Rosin Solder Paste Tin Rosin-Based

80g BGA Solder Flux Paste Solder Flux Paste High Synthetic Solder Flux Past for PCB ,BGA,SMD, PGA Repair Soldering Rework Station Product Introduction: ※MECHANIC Advanced Paste Flux Soldering for mobile phone motherboard Repair ※High synthetic BGA Solder Flux Paste BGA Soldering Tin Cream ※Applicable to PCB, BGA, SMD, PGA repair soldering ※Solder paste welding fluxes for soldering station tin cream welding seal grease Tools ※Electric Soldering Iron Welding Fluxes for phone circuit board repair Product Features: ※High bond strength, PH value neutral, insulation is strong, welding surface smooth ※It is no corrosivefor IC and PCB ※Its boiling point only slightly higher than the melting point of the solder ※For mobile phones, PC cards and other sophisticated electronic chip-level help welding Optional Model: ※Option 1: MCN-UV50 ※Option 2: MCN-UV80 Specifications: ※Model: MECHANIC-UV80 ※Color: Yellow ※Weight: 0.08kg ※Viscosity: 0.2Pas ※Granularity: 0.22um ※Packing: Aluminum box Notes: ※1.Wipe the surface of the object before soldering. ※ 2.Apply the paste flux to the solder joint. ※3.Solder the tin to the solder joint with soldering iron. Package List: ※1*MECHANIC Paste Flux