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Get it between 2024-12-31 to 2025-01-07. Additional 3 business days for provincial shipping.
U6-PRO is a high quality gummy / sticky thermal paste designed for use on memory chips and other components where thermal pads are originally used.
U6-PRO has thermal conductivity K>12,8 W/m.K * (at least 7 times higher than common thermal pads that are used on computers and commercial electronics).
U6-PRO is applied very easily directly on the component and has no electrical conductivity. Operational temperature -90 to 300 degrees (Celsius).
No expiration date. Infinite storage/service life. U6 PRO doesn’t dry out. Store in closed can and protect from frost and dust. Made in Greece (European Union).
Compatible with many gaming laptops, game consoles, high end video boards, crypto mining etc. Compatible with Apple iMac, Asus ROG, Acer Nitro, MSI laptops, RTX 3080, 2080TI, 3090, PS4, Nintendo Switch, XBOX and all systems that use thermal putty or thermal pads
U6-PRO is a viscous thermal paste designed for thermal pad replacement. It is often referred to as &ldquo Liquid Thermal Pad” or “Thermal Putty”. U6-PRO is developed and produced by the Computer Systems research department. This offer is for a 1 X 10g syringe of U6 PRO high quality / high thermal conductivity gummy thermal paste. Quantity enough for around 10-20 applications. The packet includes a plastic spatula 2x finger sleeves. The product comes in a syringe with a convenient 5mm wide tip for easy application. Please install the piston of the syringe carefully and slowly without removing the tip cover or the gelatin seal CSGR. IMPORTANT NOTICE! This is an original Made in Greece product. Be careful of counterfeit imitations Made in China. Applications Automotive Electronic Control Units Heat sink, Memory modules LED Lighting, LCD-TV Military Electronics Power Supplies Telecom services, Wireless instruments Infinite storage/service life. U6 PRO doesn’t dry out. Store in a closed can and protect from frost and dust. Made in Greece (European Union) * Computer Systems materials science laboratory testing: Method using a comparative technique (P. Karydopoulos, P. Frantzis, N. Karagiannis MSAIJ 2014). Maximum thermal conductivity is measured when a 1.5mm thick thermal pad is replaced with U6 PRO combined with a 1mm thick copper pad. When you should replace the thermal paste/pads in your computer: Thermal paste and thermal pads should be replaced every time that the heat sink is removed (for cleaning, upgrade, or other maintenance). Replacing the thermal pads and the gummy thermal paste that is used by many manufacturers on the memory chips is very important when the heat sink is removed. If you reuse the same thermal pads or paste it is impossible for the heat sink to fit perfectly again and the component will be overheated and will fail soon