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Get it between 2025-01-03 to 2025-01-10. Additional 3 business days for provincial shipping.
🔻【Main Control Chip Features】This SKR Mini E3 V2.0 motherboard uses the STM32F103RCT6 main control chip, and its flash memory size is 256K.
🔻【CNC Fan】Because the fan on the SKR Mini E3 V2.0 control board is a CNC fan, you need to set the wind speed before using it. (Note: V2.0 version of the fan is not ready to use after power on).
🔻【Hot-bed Mosfet】The hot bed MOS tube uses WSK220N04, low on-resistance, larger heat dissipation area, and reduce heat generation.
🔻【Upgrade Features】Support BLtouch, filament detection, power-off resume, automatic shutdown, etc .; Increase the distance between the driving chip and the components to avoid the trouble caused by the heat sink;
🔻【After-sales Support】If you encounter any problems, please write us via Amazon as soon as possible. We have professional technical after-sales personnel to solve your problems;
Question: What are the differences between the main control chips STM32F103RET6 and STM32F103RCT6? Answer: The biggest difference between them is the flash memory size: STM32F103RET6 has a flash memory size of 512K; and STM32F103RCT6 has a flash memory size of 256K. If you encounter any problems, please contact us via Amazon as soon as possible. We have professional technical after-sales personnel to solve your problems. BIGTREETECH SKR MINI E3 V2.0 Motherboard features: (Mainly introduces upgrades based on V1.2) (1) Use MP1584EN power chip, support 12-24V power input, the maximum output current can reach 2.5A. (2) The hot bed MOS tube uses WSK220N04, low on-resistance, larger heat dissipation area, and reduce heat generation. (3) Onboard Sensorless homing function, which can be used by plugging in the jump cap. (4) Optimize the plate and frame to avoid the phenomenon of screw hole gap and screws hitting components. (5) Support BLtouch, filament detection, power-off resume, automatic shutdown, etc. (6) Onboard EEPROM: AT24C32. (7) Add parallel double Z-axis interface. (8) Increase the board layer: 4 layer board. (9) Increase the heat dissipation area of the back driver and strengthen the heat dissipation capacity. (10) Two CNC fan interfaces. (11) Increase the distance between the driving chip and the components to avoid the trouble caused by the heat sink. ; (12) Add protection device to the thermistor interface. (13) 5V power supply with BLtouch, TFT and RGB interfaces is optional. (14) The driver shares a physical UART port, which saves IO and enhances stability. Motherboard parameters: Appearance size: 100.75 * 70.25mm Layer: 4 layers MCU: ARM Cortex-M3 STM32F103RET6 Power input: DC 12 / 24V Logic voltage: 3.3V Motor driver: UART mode of onboard TMC2209