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Get it between 2024-12-04 to 2024-12-11. Additional 3 business days for provincial shipping.
BIGTREETECH Eddy V1.0 auto bed leveling sensor is designed for Klipper. Adopts inductive leveling technology, a high-frequency magnetic field is used to induce eddy currents in the conductor, and precise leveling is completed by measuring the intensity of the eddy currents
BTT Eddy V1.0 auto bed leveling sensor adopts RP2040 main control chip. The 250*250mm heatbed is leveled only 20 sec. Weight only 6g, super light&small, reduce the impact of exercise. 0.0005mm high precision. Friendly for large-size printers, high-precision leveling can be easily achieved
BIGTREETECH Eddy USB auto bed leveling sensor easily attached to Voron 2.4 StealthBurner&trident TL-Q5MC2 (PL-08N) location for quick and convenient integration, suitable for Ender, CoreXY, Voron, Vzbot, I3 series 3D printers.
BTT Eddy USB features temperature compensation and Z-axis homing, ensuring consistent, precise leveling regardless of temperature fluctuations. Customized shell effectively shields external metal interference while leaving space for the coil. It is easy to install and does not require measurement, which improves user experience and ensures detection accuracy
Widely compatible: BTT Eddy V1.0 comes with customized a 2.5m USB cable, easier wiring, compatible with btt pi + octopus pro/octopus v1.1/octopus max ez/kraken/skr mini e3 v3.0/skr v1.4 turbo/skr 3/ez, skr pico or CB1/CB2 + manta m8P/m5p/m4p, manta e3 ez motherboards
After-sales service: Notes: The spring steel sheet with a magnetic sticker heatbed solution works well with Eddy series, such as the hot bed solution of PEI steel plate+soft magnet. but it is essential to avoid interference from standalone magnets, such as round magnet hotbed (Prusa). Regardless of the any problems you encounter during the installation and use of Eddy, please tell us in time and we will provide you with detailed solutions
BIGTREETECH EDDY V1.0 is specially designed for running Klipper high-speed printing and leveling scenarios, which can effectively solve the pain point of slow leveling speed of FDM printers. This product will use induction leveling technology. Its technical principle is to use high-frequency magnetic fields to induce eddy currents in conductors, and complete precise leveling by measuring the intensity of the eddy currents. It is a non-contact leveling solution.compared with existing contact leveling modules on the market.It has the unique features of scanning high-speed leveling and is easy to install.can be easily integrated into various 3D printer systems.