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Do Not Use Thermal Glue Between CPU Chip And Heat Sink, use it within 24 hours once opened.
Thermal conductivity:> 1.2W/m-K
Strength of connected buildings: 55 lb.
Features: thermal properties, strong adhesion
Application: apply to all heatsink no fixed clip thermal paste. Ideal for MOSFET Heatsinkï VGA CARD Northbridge Southbridge Heatsink.
Br> * Application: apply to all heatsinkf no fixed clip thermal paste. Idea for MOSFET Heatsink, VGA CARD Northbridge Southbridge Heatsink. * Features: thermal properties, strong adhesion * Melting capacity: 0 (200°C/392°F / 24Hours) * Evaporation: 0.001% (200°C/392°F / 24Hours) * Thermal conductivity:> 1.2W/m-K * Thermal Impedance: 5.1 * Dissipation coefficient